鉆孔工藝是pcb多層板制(zhi)造中最(zui)重要的(de)(de)(de)工(gong)藝之(zhi)一。現在(zai)，大多(duo)數但并(bing)(bing)非所(suo)有(you)制(zhi)造商(shang)都使用數控鉆(zhan)(zhan)(zhan)孔(kong)機(ji)(ji)來鉆(zhan)(zhan)(zhan)孔(kong)。在(zai)堆疊和釘(ding)扎之(zhi)后，將層壓板放(fang)置在(zai)鉆(zhan)(zhan)(zhan)孔(kong)機(ji)(ji)的(de)(de)(de)工(gong)作(zuo)臺表(biao)面上(shang)，并(bing)(bing)將住宅銷推出到待鉆(zhan)(zhan)(zhan)孔(kong)的(de)(de)(de)層壓表(biao)面并(bing)(bing)與插(cha)入的(de)(de)(de)鉆(zhan)(zhan)(zhan)孔(kong)機(ji)(ji)上(shang)的(de)(de)(de)一排定位(wei)(wei)孔(kong)對齊(qi)。定位(wei)(wei)孔(kong)的(de)(de)(de)位(wei)(wei)置將用作(zuo)鉆(zhan)(zhan)(zhan)孔(kong)程序的(de)(de)(de)數據(ju)。所(suo)有(you)要鉆(zhan)(zhan)(zhan)孔(kong)都是根據(ju)這些銷釘(ding)排列的(de)(de)(de)。

pcb多層板需要仔(zi)細控制(zhi)鉆(zhan)孔(kong)(kong)(kong)過(guo)程(cheng)(cheng)，以確保最終(zhong)通孔(kong)(kong)(kong)電(dian)(dian)鍍(du)的(de)質(zhi)(zhi)量。通過(guo)在(zai)鉆(zhan)孔(kong)(kong)(kong)過(guo)程(cheng)(cheng)中(zhong)獲得的(de)材料特性同時調節鉆(zhan)孔(kong)(kong)(kong)的(de)轉速(su)和(he)進(jin)(jin)給速(su)率，可(ke)以控制(zhi)孔(kong)(kong)(kong)的(de)質(zhi)(zhi)量。如果鉆(zhan)頭在(zai)鉆(zhan)孔(kong)(kong)(kong)中(zhong)停(ting)留太(tai)長時間，它會使樹脂染色(se)，進(jin)(jin)給速(su)度太(tai)快，這會導致鉆(zhan)頭破裂或孔(kong)(kong)(kong)壁粗(cu)糙。孔(kong)(kong)(kong)的(de)預處理和(he)金(jin)屬(shu)化也是生產(chan)具(ju)有通孔(kong)(kong)(kong)電(dian)(dian)鍍(du)的(de)可(ke)靠pcb多層(ceng)板的(de)重要因素。良好(hao)的(de)電(dian)(dian)鍍(du)孔(kong)(kong)(kong)非常可(ke)靠，不(bu)良的(de)涂層(ceng)孔(kong)(kong)(kong)不(bu)可(ke)靠。此(ci)外，金(jin)屬(shu)化可(ke)以用碳(tan)涂層(ceng)或石墨膜(mo)代替。